JPH01143145U - - Google Patents
Info
- Publication number
- JPH01143145U JPH01143145U JP4013088U JP4013088U JPH01143145U JP H01143145 U JPH01143145 U JP H01143145U JP 4013088 U JP4013088 U JP 4013088U JP 4013088 U JP4013088 U JP 4013088U JP H01143145 U JPH01143145 U JP H01143145U
- Authority
- JP
- Japan
- Prior art keywords
- flat
- adhesive surface
- film
- cream solder
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4013088U JPH01143145U (en]) | 1988-03-26 | 1988-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4013088U JPH01143145U (en]) | 1988-03-26 | 1988-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143145U true JPH01143145U (en]) | 1989-10-02 |
Family
ID=31266606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4013088U Pending JPH01143145U (en]) | 1988-03-26 | 1988-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143145U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191495A (ja) * | 1982-04-30 | 1983-11-08 | ソニー株式会社 | 凸部を有する基板にフラツクス及び半田を付ける方法 |
-
1988
- 1988-03-26 JP JP4013088U patent/JPH01143145U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191495A (ja) * | 1982-04-30 | 1983-11-08 | ソニー株式会社 | 凸部を有する基板にフラツクス及び半田を付ける方法 |